DFRobot - Raspberry Pi Cooler for Compute Module 5

Raspberry Pi Cooler for Raspberry Pi Compute Module 5 is a compact passive thermal solution designed to improve heat dissipation for high‑performance embedded computing deployments. This aluminum heatsink integrates thermally conductive silicone pads that directly couple with key heat‑generating components on the Raspberry Pi Compute Module 5, including the CPU, wireless module, and power management chip. Efficient thermal transfer reduces thermal throttling while supporting sustained processor performance. The compact cooler also adds a layer of mechanical protection, helping safeguard the compute module in robotics systems, industrial controllers, and embedded development platforms where reliable thermal management is essential.

Figure: Raspberry Pi Cooler and Raspberry Pi Compute Module 5

Optimized Passive Thermal Dissipation

This aluminum heatsink uses a precisely matched thermal interface to draw heat away from multiple hot spots on the Compute Module 5. Thermally conductive silicone pads create efficient contact with the processor, wireless chipset, and power management circuitry, enabling stable thermal transfer without active cooling components. Passive cooling architecture eliminates fan noise, reduces maintenance requirements, and maintains long-term reliability in embedded deployments where airflow or power availability may be limited.

Figure: Install the Raspberry Pi Cooler

Mechanical Protection for Compute Module Integration

Beyond thermal performance, this Compute Module cooling accessory also provides structural protection for delicate onboard components. The rigid aluminum profile shields the processor and surrounding electronics from accidental contact or mechanical stress during system integration. Such protection becomes particularly valuable in robotics platforms, industrial controllers, and custom carrier board assemblies where the compute module operates within compact or vibration‑prone environments.

Figure: Mechanical diagram of the Raspberry Pi Cooler

This Compute Module 5 heatsink is well suited for embedded AI edge devices, industrial gateways, robotics controllers, and advanced prototyping platforms. Passive thermal management ensures stable operation under sustained workloads while maintaining silent performance and compact mechanical integration across professional and educational development environments.

• Passive aluminum heatsink designed for Raspberry Pi Compute Module 5
• Thermally conductive silicone pads for efficient heat transfer
• Improves CPU performance by reducing thermal throttling
• Provides mechanical protection for onboard components
• Fanless design for silent and maintenance‑free operation
• Compact form factor suitable for embedded system integration

• Embedded computing systems based on Compute Module 5
• Industrial automation controllers
• Robotics platforms and autonomous devices
• Edge AI and IoT gateway hardware
• STEM Education and advanced prototyping environments

• Form factor: 56mm×41mm×12.7mm
• Product material: Aluminium profile, thermally conductive silicone
• Production lifetime: The Raspberry Pi Cooler for Raspberry Pi Compute Module 5 will remain in production until at least January 2036
• Compliance: For a full list of local and regional product approvals, please visit pip.raspberrypi.com

• Raspberry Pi Cooler for Compute Module 5 x1